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The ElectroScrub
series of particle removal solutions is based on a novel approach
to amplify the electrostatic forces, which remove particles from
the surface of the wafer. Originally developed for the Hard Drive
Industry, where particle requirements are very tight, these solutions
were so successful that they are being introduced in the semiconductor
industry as well.
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1)
The Electroscrub1 basic is the original particle removal solution
and has a pH after dilution of about pH 9.5.
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2)
The Electroscrub2 is a version where in addition to Electroscrub1;
a mild abrasive is added for improved particle removal.
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3)
On top of these 2 basic versions, there are also variations,
which have a modified pH value from the basic versions. Standard
pH values (after dilution) that are available are: 12 and 14.
Custom pH values can be synthesized.
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SASIC, has
developed several OrganoEtch and OrganoClean solutions with
unique properties.
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1)
OrganoEtch:
SAS-500SSE or Buffered OrganoEtch with pH 2-3, which is a
Non-Selective organic Silica Etchant, targeted for contact
hole etch and clean
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2)
OrganoEtch1 targeted for HF-last applications with low surface
tension and excellent particle or watermark performance.
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3)
OrganoClean
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4)
OrganoStrip 1 (EBR1):
with pH 6.5-7.5 targeted for Photoresist Edge Bead Removal
with simultaneous particle removal from the wafer bevel edge.
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SASIC has
developed a Non-Sulfate photoresist stripper for the Photomask
industry. Conventional Photomask stripping based on Sulfuric
Acid mixtures is plagued with serious problems of haze formation
and ammonium sulfate crystals on the Photomask surface. The
Barracuda1 stripper does not cause such a haze.
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Copyright
© 2007 SASIC Inc. All rights reserved
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SASIC
