Conventional diluted HF or buffered HF usually leaving leads to sticking of adjacent capacitor structures and leaves watermarks and/or particles. These problems can be solved with the SASIC OrganoEtch1. This solution is capable of removing unwanted SiO2 with its low surface tension without leaving behind any watermarks or particles. The surface can be dried without any need for DI-Water rinsing. All constituents in SASIC OrganoEtch1 are volatile.

Conventional Edge Bead removers such as PGMEA and Ethyl Lactate can remove the Edge Bead photoresist very well. However, none of the conventional Edge Bead Removers are capable of removing particles from the bevel edge. This is a very important issue in immersion lithography since any remaining particles on the edge can be transferred to the active area of the wafer and contributes to low yield. The SASIC OrganoStrip 1 (EBR1) not only can remove the photoresist, similar to conventional Edge Bead Removers, but it can also remove particles from the edge.

1- In CMOS imager cleaning, devices are required to be completely clean, free of any watermarks and particles after rinsing with DI-water. The SASIC OrganoClean, such as OrganoStrip 1 (EBR1), can solve these problems without a need for DI-water rinse.

2- The SASIC OrganoClean is one of the only organic solutions that work with Megasonic. This solution can remove all particles with a Megasonic power as low as 100W.

The conventional Photomask cleaner such as hot concentrated sulfuric acid and SC1 Process (mixture of ammonium hydroxide and hydrogen peroxide) create haze on the surface of Photomask. This serious problem significantly decreases the production yield. The SASIC Photomask cleaner (Barracuda Series) is a practical solution to this problem. The SASIC Barracuda is a Non-Sulfate product capable of stripping photoresist and BARC layers on Photomask in less than 5 minutes without leaving any haze on the surface of Photomask

Currently, the patterns on the wafer are becoming so small, that they are extremely fragile and conventional particle removal methods based on applying mechanical forces such as Megasonic or high pressure aerosol spray cannot be used any more, since they damage such fragile patterns. The SASIC particle remover (ElectroScrub Series) is a chemical solution to particle removal that does not damage such fragile patterns.